Led by laser and movement consultants, discover the most recent advances in laser drilling of VIA holes — key to enabling larger bandwidth communication and compact machine footprints. Attendees will achieve perception into strategies for overcoming core challenges by fixed-optic configurations, superior movement management, and laser-to-motion synchronization.
Matt Worth (PI’s Head of Agile Options Group), Mark Turner (CEO and Founding father of Turner Laser Techniques), and Jason Goerges (ACS Movement Management’s VP Advertising and marketing) will share real-world examples, together with glass wafer drilling, illustrate how these options ship outcomes. To conclude, we’ll preview rising improvements — resembling XL SCAN, 3D error correction, and hybrid piezo movement — that trace on the future potential for even quicker and extra correct manufacturing.
Title: Newest Advances in Laser Drilling of VIA holes
Date: July 17, 2025
Time: 2:00 pm (ET)
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Industries Served
Semiconductor, photonics, optics, medical machine manufacturing
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