How a Rock Turns into a Smartphone CPU

1. Quartz

Your smartphone processor started its journey within the northwest nook of Spain, at Mina Serrabal, a quartz mine close to town of Santiago de Compostela. Quartz—or extra technically, silicon dioxide or silica—is the principle element of sand. However at Serrabal it may are available enormous items twice the width of a smartphone. Mine operator Ferroglobe runs an automatic system to kind the silica by dimension. After the items are washed and handled, the large ones head to the Atlantic coast for the following step within the journey.

2. Silicon Metallic

After an hour by truck, the quartz mini-boulders arrive at Sabón, Ferroglobe’s 125,000-square-meter manufacturing facility within the coastal province of A Coruña. Right here the quartz can be combined with dehydrated wooden chips and heated to 1,500 to 2,000 °C in a trio of electric-arc furnaces that use large electrodes invented at this plant within the Nineteen Nineties. Contained in the furnace, a response takes place that rips the oxygen from the silica and sticks it to the carbon from the wooden. The result’s silicon steel and carbon monoxide.

3. Purified Polysilicon

The ensuing silicon steel is about 98 % pure, and that’s not adequate. It can have to be a minimum of 99.9999999 % pure to develop into a microprocessor, which would require some fairly highly effective chemistry. So it’s off to Wacker Chemie, in Burghausen, Germany. Right here, the steel undergoes what’s referred to as the Siemens course of: It’s bathed in hydrochloric acid and reacts to kind hydrogen fuel and a liquid referred to as trichlorosilane. Any impurities can be within the liquid, which is then run via a multistep distillation course of that separates the pure trichlorosilane from something undesirable. As soon as the wanted purity is reached, the response is reversed: At 1,150 °C, the trichlorosilane is reacted with hydrogen to deposit a number of crystals of silicon, referred to as polysilicon, and the ensuing hydrochloric acid fuel is sucked away. The polysilicon kinds thick rods round heating components. As soon as it’s cooled and faraway from the response chamber, the polysilicon is smashed up for transport.

4. Silicon Wafers

The ultrapure silicon is made up of many crystals at totally different orientations. However microprocessors have to be produced from a single crystal. So the fabric may migrate to Sherman, Texas, the place GlobalWafers just lately opened a US $3.5 billion silicon-wafer plant. Right here the polysilicon is put via what’s referred to as the Czochralski (Cz) technique. In a high-purity quartz crucible, the polysilicon is heated to about 1,425 °C and melts. Then a seed crystal with a exact crystal orientation is dipped into the soften, slowly drawn upwards, and rotated. Do all that precisely proper, and you’ll pull up an ingot of pure, crystalline silicon that’s 300 millimeters throughout and several other meters tall. Specialised saws then slice this pillar of semiconducting purity into wafers lower than 1 millimeter thick. The wafers are cleaned, polished, and typically additional processed, earlier than heading to wafer fabs.

5. Processed Wafers

Now it’s off to Tainan, in southern Taiwan, the place TSMC’s Fab 18 will flip these wafers into the newest smartphone processors. It’s an exceedingly intricate course of, involving among the most advanced and costly tools on the planet, together with EUV lithography techniques that may value upward of $300 million every. In Fab 18, every wafer will undergo months of exquisitely exact torture to supply the transistors and wiring that make up the processors. Excessive ultraviolet radiation will print patterns onto it, scorching ions will ram into its floor, precision chemical reactions will construct up some elements one atomic layer at a time, acids will etch away nanometer-scale buildings, and metals will electrochemically plate elements and be polished away in others. The end result: a wafer stuffed with similar processors.

6. Packaged Chips

As wonderful as these processors are, you’ll be able to’t use them on this kind. They first have to be packaged. For our silicon, that’s going to occur at ASE’s facility in Penang, Malaysia. A bundle gives the chip with mechanical safety, a means for warmth to be eliminated, and a means of connecting the chip’s micrometer-scale elements to a circuit board’s millimeter-scale ones. To do that, the wafers are first diced into chips. Then tiny balls of solder, some solely tens of micrometers throughout, are hooked up to the chips. The solder bumps are aligned to corresponding elements of the bundle, and the 2 elements are melted collectively. It’s turning into extra widespread for a number of items of silicon to be built-in inside the similar bundle, both stacked on high of one another or positioned subsequent to one another on a separate piece of silicon referred to as an interposer. Different steps to the method observe, and the packaged half is now prepared for its subsequent step.

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